XA-000-09-004-007-007-016-01    16.08.24 11:11:21


ADC
cADCscan.png
HMP IV
HMPIV.png
SMX_7
SMX_7.png
CSA
cCSAscan.png
grTemperature
grTemperature.png
Temperature
SMX Temperature
Report.txt
                  TEST_NAME : Wafer
TEST_DATE : 24_08_16-11_11_21
OPERATOR  : Carmen S.; Irakli K.; 
SITE : GSI | SETUP : WAFER_TEST_SETUP
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ASIC_CONFIG_PARAMETERS
  HW_ADDR : 0x7 | VERS_NO : 2.2
  ASIC_ID : XA-000-09-004-007-007-016-01 | FUSED_ID : 6359364768380252417
  IC_TEMP :  -56.46 | VDDM : 1128.56 | AUX_INT :   -7.08 | CsaBias :   68.55
  CONF_FAIL_REG : 0
  CSA_BIAS : 5
  THR2_GLB : 30
  ADC_VREF_P : 58 | ADC_VREF_N : 30 | ADC_VREF_T : 128 | ADC_VREF_TR : 122
  ADC_Chi2/NDF : 8.97875e-04 / 2
  ADC_P0  : -7.07926e-03 ± 2.02573e-02
  ADC_P1  : 8.45964e-03 ± 5.00858e-04
  ADC_P2  : -6.21749e-06 ± 2.44406e-06
  CSA_Chi2/NDF : 1.33947e-04 / 2
  CSA_P0  : 5.79183e-02 ± 7.71950e-03
  CSA_P1  : 9.77709e-03 ± 5.81609e-04
  CSA_P2  : -4.89009e-05 ± 8.85721e-06
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ASIC_TEST_PARAMETERS
AMP_CAL : 250
   N_BROKEN_DISC :  14
 | N_BROKEN_FAST :  [8, 10, 11, 13, 14, 18, 31, 63, 81, 84, 89, 94, 95, 109]
 | N_BROKEN_SLOW :  []
   P_BROKEN_DISC :  9
 | P_BROKEN_FAST :  [2, 10, 22, 51, 62, 82, 94, 108, 111]
 | P_BROKEN_SLOW :  []
ASIC_QA_category :  NOT READY for MODULE ASSEMBLY
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VI_before_Init : ['1.202', '0.2176', '1.800', '0.1187', '1.800', '0.0848', '7.000', '0.7076', 1, 1, 1, 1, 1723799480.861632]
VI_after__Init : ['1.202', '0.2177', '1.800', '0.1187', '1.800', '0.0794', '7.000', '0.7070', 1, 1, 1, 1, 1723799488.8260982]
VI_at__the_End : ['1.201', '0.4776', '1.800', '0.1336', '1.799', '0.1131', '7.000', '0.7080', 1, 1, 1, 1, 1723799543.7770178]