XA-000-09-004-007-017-008-15    19.08.24 11:00:53


ADC
cADCscan.png
HMP IV
HMPIV.png
SMX_7
SMX_7.png
CSA
cCSAscan.png
grTemperature
grTemperature.png
Temperature
SMX Temperature
Report.txt
                  TEST_NAME : Wafer
TEST_DATE : 24_08_19-11_00_53
OPERATOR  : Carmen S.; Irakli K.; 
SITE : GSI | SETUP : WAFER_TEST_SETUP
------------------------------------------------------------
------------------------------------------------------------
ASIC_CONFIG_PARAMETERS
  HW_ADDR : 0x7 | VERS_NO : 2.2
  ASIC_ID : XA-000-09-004-007-017-008-15 | FUSED_ID : 6359364768380293263
  IC_TEMP :  -60.40 | VDDM : 1122.06 | AUX_INT :   -8.12 | CsaBias :   59.56
  CONF_FAIL_REG : 0
  CSA_BIAS : 5
  THR2_GLB : 30
  ADC_VREF_P : 58 | ADC_VREF_N : 30 | ADC_VREF_T : 128 | ADC_VREF_TR : 122
  ADC_Chi2/NDF : 1.08484e-03 / 2
  ADC_P0  : -8.11991e-03 ± 2.22982e-02
  ADC_P1  : 8.50749e-03 ± 5.56854e-04
  ADC_P2  : -5.88597e-06 ± 2.76104e-06
  CSA_Chi2/NDF : 1.60388e-04 / 2
  CSA_P0  : 5.66613e-02 ± 8.44711e-03
  CSA_P1  : 9.84749e-03 ± 6.36429e-04
  CSA_P2  : -4.94317e-05 ± 9.69206e-06
------------------------------------------------------------
ASIC_TEST_PARAMETERS
AMP_CAL : 250
   N_BROKEN_DISC :  9
 | N_BROKEN_FAST :  [18, 44, 58, 65, 84, 95, 98, 123]
 | N_BROKEN_SLOW :  [105]
   P_BROKEN_DISC :  11
 | P_BROKEN_FAST :  [4, 8, 13, 15, 25, 35, 50, 84, 91, 105]
 | P_BROKEN_SLOW :  [105]
ASIC_QA_category :  NOT READY for MODULE ASSEMBLY
------------------------------------------------------------
------------------------------------------------------------
VI_before_Init : ['1.201', '0.3685', '1.800', '0.1338', '1.799', '0.0947', '7.000', '0.7074', 1, 1, 1, 1, 1724058053.4464889]
VI_after__Init : ['1.201', '0.3688', '1.800', '0.1339', '1.800', '0.0887', '7.000', '0.7073', 1, 1, 1, 1, 1724058061.4269326]
VI_at__the_End : ['1.202', '0.4764', '1.800', '0.1345', '1.799', '0.1137', '7.000', '0.7081', 1, 1, 1, 1, 1724058117.620495]