
XA-000-09-004-043-006-007-08 11.10.24 14:58:23

ADC

HMP IV

SMX_7

CSA

grTemperature

Report.txt
TEST_NAME : Wafer TEST_DATE : 24_10_11-14_58_23 OPERATOR : Oleksandr S.; Irakli K.; SITE : GSI | SETUP : WAFER_TEST_SETUP ------------------------------------------------------------ ------------------------------------------------------------ ASIC_CONFIG_PARAMETERS HW_ADDR : 0x7 | VERS_NO : 2.2 ASIC_ID : XA-000-09-004-043-006-007-08 | FUSED_ID : 6359364768417996920 IC_TEMP : -70.79 | VDDM : 1120.46 | AUX_INT : -35.72 | CsaBias : 51.76 CONF_FAIL_REG : 0 CSA_BIAS : 5 THR2_GLB : 30 ADC_VREF_P : 58 | ADC_VREF_N : 30 | ADC_VREF_T : 128 | ADC_VREF_TR : 122 ADC_Chi2/NDF : 1.98150e-03 / 2 ADC_P0 : -3.57232e-02 ± 3.19107e-02 ADC_P1 : 8.81921e-03 ± 7.78766e-04 ADC_P2 : -7.11142e-06 ± 3.76388e-06 CSA_Chi2/NDF : 2.07334e-04 / 2 CSA_P0 : 5.69398e-02 ± 9.60411e-03 CSA_P1 : 9.98409e-03 ± 7.23601e-04 CSA_P2 : -5.33920e-05 ± 1.10196e-05 ------------------------------------------------------------ ASIC_TEST_PARAMETERS AMP_CAL : 250 N_BROKEN_DISC : 2 | N_BROKEN_FAST : [67, 104] | N_BROKEN_SLOW : [] P_BROKEN_DISC : 0 | P_BROKEN_FAST : [] | P_BROKEN_SLOW : [] ASIC_QA_category : NOT READY for MODULE ASSEMBLY ------------------------------------------------------------ ------------------------------------------------------------ VI_before_Init : ['1.202', '0.3038', '1.800', '0.1297', '1.800', '0.0971', '7.000', '0.7081', 1, 1, 1, 1, 1728651502.7342176] VI_after__Init : ['1.202', '0.3040', '1.800', '0.1297', '1.800', '0.0919', '7.000', '0.7083', 1, 1, 1, 1, 1728651511.5106113] VI_at__the_End : ['1.202', '0.4673', '1.800', '0.1355', '1.799', '0.1196', '7.000', '0.7088', 1, 1, 1, 1, 1728651571.9880548]