As a consequence of the fact, that not everybody could attend the discussion focused mainly on the redesign of the plane 2 modules before mass production will start.

The following aspect were discussed:

• Design upgrades of plane 2 are mainly a modification in the shape of the sidebars to further decrease the sag. The general concept of a super-layer made from two individual Stesalit-layers and PCB, which are finally glued together, will still be followed.
• Updated workshop drawings will be prepared until September 97 and provided to the project co-ordinator who will check the compatibility together with the project engineer and the technical director.
• The drawing of the aluminium support frames should be provided by the LHE as soon as possible and before the manufacture to introduce possible changes necessary for the mounting of the chamber into the mainframe.
• The drawing of the new PCB design will be provided to the project co-ordinator.
• Special grounding strips on the aluminium support frame should be introduced to improve the common ground of the system.
• Oleg Fateev proposed to use for the HV filtering load resistors of 30 MO and 1.5 nF.
• It was mentioned that for the production of the prototype 1 the wire tension for the aluminium wire was chosen to 70 g. After the production, a loss of tension due to variations in the final solder tab position was about 15 %. A constructional trick was applied to improve the tension.
• For the connection of the 13 individual potentials a AMP block connector will be used.
• Gas connection will be made with swagelock products.

In a second part Frank Dohrmann reported about his activities to learn about experiences other collaborations made with aluminium wire. He also got a new offer from California Fine Wire, which shows that the price of bare aluminium wire went up as a result of a modified production process. On the other hand the price for the gold plated wire went down so that by now the price difference is only a little more than a factor of 2

Joachim Stroth.