XA-000-09-004-031-007-003-06 23.09.24 19:21:56
ADC
HMP IV
SMX_7
CSA
grTemperature
Info
TEST_NAME : Wafer
TEST_DATE : 24_09_23-19_21_56
OPERATOR : Carmen S.; Irakli K.;
SITE : GSI | SETUP : WAFER_TEST_SETUP
------------------------------------------------------------
------------------------------------------------------------
ASIC_CONFIG_PARAMETERS
HW_ADDR : 0x7 | VERS_NO : 2.2
ASIC_ID : XA-000-09-004-031-007-003-06 | FUSED_ID : 6359364768405418038
IC_TEMP : -74.66 | VDDM : 1117.78 | AUX_INT : -8.66 | CsaBias : 52.00
CONF_FAIL_REG : 0
CSA_BIAS : 5
THR2_GLB : 30
ADC_VREF_P : 58 | ADC_VREF_N : 30 | ADC_VREF_T : 128 | ADC_VREF_TR : 122
ADC_Chi2/NDF : 1.59731e-03 / 2
ADC_P0 : -8.65674e-03 ± 2.70019e-02
ADC_P1 : 8.71907e-03 ± 6.60979e-04
ADC_P2 : -7.77928e-06 ± 3.18948e-06
CSA_Chi2/NDF : 1.56262e-04 / 2
CSA_P0 : 5.34656e-02 ± 8.33774e-03
CSA_P1 : 9.43695e-03 ± 6.28189e-04
CSA_P2 : -4.84845e-05 ± 9.56657e-06
------------------------------------------------------------
ASIC_TEST_PARAMETERS
AMP_CAL : 250
N_BROKEN_DISC : 3
| N_BROKEN_FAST : [102, 123, 126]
| N_BROKEN_SLOW : []
P_BROKEN_DISC : 2
| P_BROKEN_FAST : [41, 61]
| P_BROKEN_SLOW : []
ASIC_QA_category : A ASIC READY for MODULE ASSEMBLY
------------------------------------------------------------
------------------------------------------------------------
VI_before_Init : ['1.202', '0.3378', '1.800', '0.1425', '1.800', '0.0989', '7.000', '0.7082', 1, 1, 1, 1, 1727112116.4628632]
VI_after__Init : ['1.202', '0.3386', '1.800', '0.1427', '1.800', '0.0930', '7.000', '0.7081', 1, 1, 1, 1, 1727112124.5031664]
VI_at__the_End : ['1.202', '0.4506', '1.800', '0.1305', '1.800', '0.1204', '7.000', '0.7088', 1, 1, 1, 1, 1727112186.619907]