DTL-STS tests database

Link to ladder: L4DR500018

Module [ Site: GSI] versions: M4DR5T1000181B2 | QR pdf

FEB_A: 1362 FEB_B: 2332

Thermally Tested in Hk.Hl.

Tested Uplinks in Hk.Hl.

-- Last status: 2026-03-05 11:37 [ Undef. status at Hk.Hl. ]

Desired grade: C

Link to Sensor: 16094 (Grade: B) -- size: 62x124 mm

Link to Heck Halle Module Test Page

History of statuses:

2026-03-05 11:37:00 { Uli Frankenfeld } [ Undef. status at Hk.Hl. ] GSI
2026-02-26 13:44:00 { Gnana Sindhu Subramanya } [ Tested in Hk.Hl. ]
2026-02-17 13:06:00 { Kerstin Schuenemann } [ Undef. status at Hk.Hl. ] GSI
2025-06-20 16:50:00 { Lady CollazoSanchez } [ Tested in Hk.Hl. ] GSI
2025-05-05 15:00:00 { Lady CollazoSanchez } [ Test started in Hk.Hl. ] GSI
2025-02-28 08:07:00 { Oleksandr Suddia } [ Tested Ch Cl.Ro. ] GSI
2023-11-11 10:00:00 { Irakli Keshelashvili } [ Reserved ] GSI

Comments:

2026-03-18 11:27 { Christian Schmidt } ( rework ongoing, one chip cable still missing )
2026-03-16 14:37 { Oleksandr Suddia } ( FEB "A" ASIC0, ASIC3 - New, ASIC4 - UL1 to UL0 (ULX); FEB "B" UL1 to UL0 (ULX) )
2026-03-05 11:41 { Uli Frankenfeld } ( Multiple solutions: ULX scheduled. ASIC exchange scheduled. Usage of UL0 only. )
2026-02-25 16:14 { Johann Heuser } ( inspect for solution to ODI )
2026-02-16 16:06 { Anju Sharma } ( Low ODI (N-side: ASIC 3, UL_1, 550Ohms, ASIC 4,5,6,7 mostly < 1kohms), (P-side : ASIC 7, UL_ 0, 1.7kOhms) )

Workflow

WF_2025_03_26_13_43_21.pdf WF_2025_10_20_09_54_28.pdf

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