DTL-STS tests database

Link to ladder: L5UL301017

Module [ Site: KIT] versions: M5UL3T0110170B2 | M5UL3T0010170B2 | QR pdf

FEB_A: 3008 FEB_B: 4008

Thermally Tested in Hk.Hl.

Tested Uplinks in Hk.Hl.

-- Last status: 2024-06-19 10:54 [ Dismissed ]

Desired grade: B

Link to Sensor: 25152 (Grade: B) -- size: 62x42 mm

History of statuses:

2024-06-19 10:54:04 { } [ Dismissed ] KIT
2024-06-11 14:19:04 { } [ Bonded in Cl.Ro. ] KIT
2024-06-04 13:55:04 { } [ Bonded in Cl.Ro. ]
2024-05-16 13:17:18 { Irakli Keshelashvili } [ Bonded in Cl.Ro. ] GSI
2024-05-16 10:13:31 { Irakli Keshelashvili } [ Bonded in Cl.Ro. ] GSI
2024-05-16 10:07:17 { Irakli Keshelashvili } [ Bonded in Cl.Ro. ] GSI
2024-05-15 12:50:07 { Irakli Keshelashvili } [ Bonded in Cl.Ro. ] GSI
2023-11-11 10:00:00 { Irakli Keshelashvili } [ Reserved ] KIT

Comments:

2025-05-23 10:09 { Uli Frankenfeld } ( High ohmic (parallel) current )

Workflow

WF_2025_10_17_08_42_35.pdf WF_2025_10_17_11_11_11.pdf

No documents uploaded yet.

⇧ Top