Link to ladder: L5UR001156
Module [ Site: KIT] versions: M5UR0B3011563B2 |
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Tests:
Thermal test
2025-08-04 11:03
Lady CollazoSanchez
-- Last status: 2026-03-30 10:49 [ Tested Ch Cl.Ro. ]
Desired grade: C
History of statuses:
Comments:
- 2026-03-30 10:50 { Oleksandr Suddia } ( The ASIC1 was re-bonded to the sensor and tested )
- 2026-03-26 17:02 { Oleksandr Suddia } ( ASIC1 was replaced )
- 2026-03-16 13:31 { Christian Schmidt } ( On this module one chip is being replaced. It has been set to ODI-OK too early. Set back to pending )
- 2026-02-16 14:28 { Anju Sharma } ( ODI OK )
- 2025-10-07 11:14 { Anju Sharma } ( Ohmic behaviour )
- 2025-08-12 11:05 { Lady CollazoSanchez } ( 74 broken channels (5 on p-side and 67 on n-side). 62 of the n-side broken channels are located in the ASIC HW 6 )
- 2025-02-24 10:47 { Johann Heuser } ( IV grade C still acceptable. Thus to be used. )
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Change Module Status:
Ladder: L5UR001156
Module: M5UR0B3011563B2
Sensor: 09384
Status: Tested Ch Cl.Ro.